Multiphysics Draws Over 250 Engineers, Researchers, and Scientists to Boston

BURLINGTON, MA (October 10, 2007) - More than 250 of the world’s top practitioners of multiphysics simulation concluded this past Saturday three days of practical hands-on training, exchanging ideas, and evaluating of the latest multiphysics modeling technology at the close of the 2007 COMSOL Conference in Boston. The next stop for this annual conference that focuses on multiphysics modeling and simulation for engineering and scientific research is Grenoble France, October 23.

The Boston conference, held at the Boston Marriott in Newton, MA, attracted COMSOL Multiphysics users from more than 180 companies, military research centers, and academic institutions from over 10 countries. The program of events offered attendees more than 100 user presentations as well as nearly three dozen minicourses and tutorial sessions on such topics as AC/DC systems, acoustics, bioengineering, chemical engineering, earth science and porous media flow, electrostatics and electromagnetics, fluid dynamics, fluid structure interactions, heat transfer, materials science, MEMS, microfluidics, microwaves and RF, optics, parallel processing in COMSOL Multiphysics, thermo-mechanics, structural mechanics, and scientific and engineering education.

The conference also included a large poster session and a banquet luncheon honoring the best technical papers and posters as voted on by the program committee and conference attendees. The opening night networking reception was sponsored by NASA Tech Briefs, which also organized and sponsored a session on multiphysics. The NASA Tech Briefs session on multiphysics provided presentations by speakers from Idaho National Laboratory, Stanford University, Green Mountain Engineering, Rensselaer Polytechnic Institute, and ZINK Imaging.

Conference keynote speakers included Jim Knox of NASA’s Marshall Space Flight Center speaking on the development of adsorption equipment for extended-duration space missions and John Tanski from Los Alamos National Laboratory on ensuring the reliability and safety of the nation’s strategic weapons stockpile. Also, Ron Gamache described how he and his colleagues at TransTech Systems developed a better electromagnetic sensor with COMSOL Multiphysics., and the research team of Dr. Darrell Pepper from the University of Nevada-Las Vegas and Xiuling Wang from Purdue University-Calumet explained the results of their benchmark tests of COMSOL Multiphysics.

In his keynote address COMSOL’s President and CEO Svante Littmarck introduced attendees, partners, and journalists to version 3.4 of the COMSOL Multiphysics suite of solutions. “In nature,” said Littmarck, “multiple physics phenomena always interact. COMSOL Multiphysics provides engineers, researchers, and scientists tools to model these multiphysics interactions, enabling you to perform analysis and develop products that you could not before. With version 3.4 users benefit from the groundbreaking combination of flexibility and speed in setting up and solving multiphysics problems. And we’re steaming ahead introducing automated solver selection in a future version minimizing time to solution.”

Littmarck also reminded attendees of the significant part they play in the development of COMSOL Multiphysics and its entire complement of physics-specific application modules. “You’ve helped us build a great product as well as a great community,” he said. “Keep telling us what you need and want, and we’ll keep developing and expanding COMSOL Multiphysics to address your ever-evolving multiphysics modeling requirements.”

The 2007 COMSOL User Conference World Tour next convenes at the Europole, World Trade Center in Grenoble, France, October 23 – 24. A complete description of the 2007 COMSOL User Conference-Grenoble is available on the COMSOL website.

Localized versions of the 2007 COMSOL User Conference will be held throughout China, Japan and Southeast Asia during November. The final stop for the 2007 COMSOL User Conference World Tour will be Tel-Aviv, Israel, on December 17. For a complete list of dates and locations, conference registration details, or for more information about COMSOL Multiphysics 3.4, visit the COMSOL Inc. website.

About the COMSOL product line

COMSOL Multiphysics is the first software environment to provide scientists, engineers, and researchers with integrated, best-in-class technology for modeling, simulating, and discovering any system with both single or multiple physics phenomena. A broad range of discipline-specific modules extends the COMSOL environment for chemical engineering, earth science, electromagnetics, heat transfer, MEMS, and structural mechanics applications. COMSOL also offers the COMSOL Reaction Engineering Lab®, which allows users to model reacting systems. COMSOL products are available for the Windows, Linux, Solaris, and the Macintosh operating systems. Full details about COMSOL Multiphysics and related products are available at www.comsol.com.

About the COMSOL Group

COMSOL was founded in 1986 in Stockholm, Sweden, and has grown to include offices in the Benelux, Denmark, Finland, France, Germany, Italy, Norway, Switzerland, the United Kingdom, and a US presence with offices in Burlington, MA, Los Angeles, CA, and Palo Alto, CA. Additional information about the company is available at www.comsol.com

COMSOL, COMSOL Multiphysics, COMSOL Reaction Engineering Lab and FEMLAB are registered trademarks of COMSOL AB. MATLAB is a registered trademark of The MathWorks, Inc. Other products or brand names are trademarks or registered trademarks of their respective holders.