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Address:
COMSOL, Inc.
1 New England Executive Park, Ste 350
Burlington, MA 01803 USA
Phone: +1 781-273-3322
Fax: +1 781-273-6603
Web: www.comsol.com
Email: info@comsol.com

Editor Contacts:
Bernt Nilsson, Senior VP of Marketing
COMSOL Inc.
bernt@comsol.com





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Fourth Annual Multiphysics Conference Poised to Set Attendance Records



More than 2000 scientists, engineers, researchers, and practitioners of multiphysics modeling expected to attend the COMSOL Conference worldwide.

BURLINGTON, MA (August 26, 2008) — COMSOL, Inc., announces the Fourth Annual COMSOL Conference, a worldwide series of conferences dedicated to the latest developments in multiphysics modeling, simulation, and virtual prototyping. The COMSOL Conference 2008 Boston, the first event in this year's sequence, will be held on October 9-11 at the Renaissance Boston Waterfront Hotel. The Conference tour then moves on to major cities throughout Asia and Europe with a final stop in Tokyo in early December.

“This year’s worldwide COMSOL conferences will attract over 2,000 attendees, and include hundreds of user presentations,” says Bernt Nilsson, Senior VP of Marketing with COMSOL. “The COMSOL Conference has become the event where scientists and engineers meet to shape the future through multiphysics simulation. It’s a unique opportunity to learn about advances in multiphysics and to network with the world's leading academic, engineering, and scientific practitioners of multiphysics simulation and modeling.”

Highlighting the COMSOL Conference 2008 Boston will be several technology overviews from COMSOL executives as well as inspiring keynote speeches by users of COMSOL. Keynote speakers at the conference will detail how multiphysics simulation plays a vital role in new technology for space exploration, groundbreaking nanomedical therapies, clean and efficient power generation from coal, and electromagnetic research.

Among the keynote speakers are:

The COMSOL Conference 2008 Boston is also packed with training opportunities: Attendees can choose from 17 hands-on minicourses on topics ranging from interfacing CAD with multiphysics to such specialized subjects as MEMS, chemical engineering, electromagnetics, fluid dynamics, thermal stress, and structural-acoustics interactions. A suite of tutorial presentations explore parallel processing, offer modeling tips and tricks, and show attendees how to access material property databases for multiphysics simulations. Also throughout the conference venue, hands-on demo stations staffed by COMSOL experts showcase new products and offer attendees on-the-fly insights to help with their multiphysics simulations.

In addition to the keynote addresses, over 100 engineers, scientists, and researchers will offer Boston attendees unique user presentations on their applications of COMSOL Multiphysics in simulation projects. Presenters will address a wide range of specialties, from disciplines as diverse as acoustics, bioengineering, chemical engineering, earth science, electromagnetics, optical modeling, and transportation phenomena. User presentations topics include:

“What I liked most about the COMSOL Conference was the ability to see how others implement solutions,” adds Matt Hull, Program Scientist with Duracell Inc. of Bethel, CT. “Every time I attend, I take back something to use in my own work. Sometimes it’s a trick learned in a minicourse, or sometimes an insight gained from one of the many user talks.”

Further highlights of the COMSOL Conference 2008 Boston include roundtable panel discussions, an exhibition area for partner products and services, daily networking events, a large poster session, and a banquet luncheon honoring the best technical papers and posters as voted on by the program committee and conference attendees.

After Boston, the COMSOL Conference 2008 travels to the Hannover Congress Centrum in Hannover, Germany, November 4 - 6, then on to Beijing, Budapest, Dhahran, Kuala Lumpur, Madrid, Shanghai, Singapore, Taipei, Tel-Aviv, and Tokyo.

The COMSOL Conference is sponsored by ACES, CEP, Design World, Desktop Engineering, MatWeb, Microwave Journal, NASA Tech Briefs, and SpaceClaim Corp. Complete details, including registration information for the Boston event as well as any of the localized versions of the COMSOL Conference 2008, are available on the COMSOL website, www.comsol.com/conference2008/usa/.

Note to editors: Members of the press are invited to attend the conference at no charge. Please contact Bernt Nilsson ( bernt@comsol.com) for information and free registration.

 

About the COMSOL product line

COMSOL Multiphysics® is a scientific-software environment for the modeling and simulation of any physics-based system. A particular strength is its ability to account for multiphysics phenomena. Optional modules add discipline-specific tools for interfacing CAD, chemical engineering, earth science, electromagnetics, heat transfer, MEMS, and structural mechanics. Other products include COMSOL Reaction Engineering Lab®, which allows users to model reacting systems. The COMSOL products are available for the Windows, Linux, Solaris, and the Macintosh operating systems. Full details about COMSOL Multiphysics and related products are available at www.comsol.com.

 

About the COMSOL Group

COMSOL was founded in 1986 in Stockholm, Sweden, and has grown to include offices in the Benelux countries, Denmark, Finland, France, Germany, Italy, Norway, Switzerland, the United Kingdom, and in the US with offices in Burlington, MA, Los Angeles, CA, and Palo Alto, CA. Additional information about the company is available at www.comsol.com.

COMSOL, COMSOL Multiphysics, COMSOL Reaction Engineering Lab and FEMLAB are registered trademarks of COMSOL AB. Other products or brand names are trademarks or registered trademarks of their respective holders.

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