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Ten Most Popular Papers
Tanai L. Marin,
Faculty of Physics and Mathematics Sciences,
Department of Mining Engineering,
University of Chile,
Santiago, Chile
A method for the solidification of a free surface liquid phase is presented and solved with COMSOL Multiphysiscs using a fixed grid. In this case, the Level set method with phase re-injection for mass conservation is used to prescribe the movement of the free surface of the liquid droplet,...
M. Moguedet1, P. Namy2, and Y. Béreaux3
1Pôle Européen de Plasturgie, Bellignat, France
2SIMTEC, Grenoble, France
3LAMCOS, Site de Plasturgie, INSA Lyon, Bellignat, France
The work presented here deals with the simulation of the cavity filling stage of the injection and micro-injection molding process for thermoplastic materials.
COMSOL Multiphysics gives us the means to take into consideration some other aspects usually neglected in commercial 3D softwares...
S. Bechu, T. V. Tran, A. Lacoste, A. Bès, M. Rayar, and J. Pelletier
Laboratoire de Physique Subatomique et de Cosmologie Centre de Recherche Plasma, Matériaux-Nanostructures, Université J. Fourier, Grenoble, France
The simulation of plasma produced by a dipolar source requires a global, self consistent, modeling of its function.
A first optimization of the dipolar source, magnetostatics, microwave propagation and fast electron trajectories (Particles in Cell (PIC) and Monte-Carlo hybrid method)...
Castaings, M.1, Predoi, M.V.2, Hosten, B.1 1 Laboratoire Mécanique Physique, Univ. Bordeaux 1, UMR CNRS 5469, Talence, France
2 Catedra de Mecanica, Universitatea Politehnica Bucuresti, Bucuresti, Romania
Wave propagation in elastic waveguides is a problem of constant interest from the last decades. Several numerical approaches exist. The most intuitive uses time-marching routines that solve the equations of dynamic equilibrium and supply displacements of the structure nodes as time functions. This...
Profaizer, M.
Nestlé Waters Italy
Shelf life estimation is a very important issue in the beverage industry. Depending on the packaging application, estimation of the carbon dioxide loss through the plastic bottle walls has always been desirable and challenging at the same time. In this work an FEM approach is presented, which...
F. Jimenez, S. D. Ekpe, and S. K. Dew
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB, USA
The plasma characteristics of a low pressure plasma discharge are dependent on the process conditions in a complicated manner. In order to understand this dependence, a comprehensive model, which takes into consideration the effects of the E x B field and gas heating on the...
Varela, A.E., Suárez, M.
Universidad de Carabobo, Facultad de Ingeniería, Valencia, Venezuela
The thermoplastics injection-molding process of has become one of the most important polymer processing operations in the production of molded parts with geometric complexity and high precision. Modeling and computer simulation of this process is not an easy task. Commercial computer packages...
B. Revaz1,2, C. Giannetti2, F. Banfi1, M. Montagnese3, G. Ferrini2, and F. Parmigiani3,4
1 University of Geneva, Switzerland
2 Università Cattolica del Sacro Cuore, Brescia
3 Università degli Studi di Trieste
4Sincrotrone Trieste, I-34012 Basovizza, Trieste
We present in this paper, numerical simulations of the heat transfer and elastic dynamics of permalloy nanodisks on crystalline Si. The goal of this work is to simulate recent pump-probe laser experimental results obtained in our laboratory.
J. Brcka
TEL Technology Center, America, LLC
Hydrogen plasma is typically used in the semiconductor industry for materials processing, surface preparation and cleaning of silicon wafers and thin films. In this contribution, we developed a 2D/3D plasma fluid model as described by the set of the species and energy balance equations in a...
Darrell Pepper
Professor of Mechanical Engineering
Director of the Nevada Center for Advanced Computational Methods (NCACM)
University of Nevada, Las Vegas
Las Vegas, NV
In this presentation, four benchmark problems are tested using COMSOL Multiphysics as well as other commercial software packages, comparing their performance. This is done for fluid-structure interaction, fully coupled electronic current conduction with thermal and structural analysis,...